Changes in Beneficial Ownership · 4
Aehr Test Systems
AEHRNASDAQEQUITYCurrent
Changes in Beneficial Ownership
Structured filing — 4
primary_01.xml
Filing details
- Report period
- 2026-09-01
- Issuer
- AEHR TEST SYSTEMS
- Issuer CIK
- 0001040470
- Trading symbol
- AEHR
Reporting owner 1
- Name
- Siu Chris
- Reporting owner CIK
- 0001389044
- Relationship
- Officer
- Officer title
- CFO
- Address
- C/O AEHR TEST SYSTEMS, 400 KATO TERRACE, FREMONT, CA, 94539
Non-derivative transactions
| Security | Transaction date | Code | Amount | A / D | Price (USD) | Owned after | Ownership |
|---|---|---|---|---|---|---|---|
| Common Stock | 2026-09-01 | F · Form 4 | 496[F1] | D | 76.59 | 77,328[F2] | D |
Table key
- F · Form 4
- Securities delivered or withheld for exercise price or tax liability under Rule 16b-3
- D
- Direct
Non-derivative holdings
| Security | Amount owned | Ownership | Nature of ownership |
|---|---|---|---|
| Common Stock | 5,706 | I | By Trust |
Table key
- I
- Indirect
Footnotes
Signature 1
- Signed
- /s/SIU CHRIS
- Date
- 2026-09-01
Company context
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced AI processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and the FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and t
Current securities
Recent company filings
- Results of Operations and Financial ConditionNov 2, 2026
- Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory ArrangementsOct 29, 2026
- Submission of Matters to a Vote of Security HoldersOct 20, 2026
- ARS filingSep 10, 2026
- DEF 14A filingSep 9, 2026