Notice of Proposed Sale · 144
Onto Innovation Inc.
ONTONYSEEQUITYCurrent
Notice of Proposed Sale
Structured filing — 144
primary_doc.xml
Notice of proposed sale. The proposed amounts below do not establish that a sale occurred.
Proposed-sale notice
- Issuer
- ONTO INNOVATION INC.
- Issuer CIK
- 0000704532
- SEC file number
- 001-39110
- Phone
- (978) 253-6200
- Person for whose account securities are to be sold
- DAVID B MILLER
- Relationships to issuer
- Director
- Street
- 16 Jonspin Road
- City
- Wilmington
- State / country code
- MA
- Postal code
- 01887
Securities proposed for sale
| Security | Proposed units | Aggregate market value | Units outstanding | Approximate sale date | Exchange | Broker / market maker |
|---|---|---|---|---|---|---|
| Common | 2,000 | 600,000.00 | 49,074,247 | 09/29/2026 | NYSE | Morgan Stanley Smith Barney LLC Executive Financial Services |
Broker / market maker — proposed row 1, entry 1
- Name
- Morgan Stanley Smith Barney LLC Executive Financial Services
- Street
- 1 New York Plaza
- Street (continued)
- 8th Floor
- City
- New York
- State / country code
- NY
- Postal code
- 10004
Acquisition of securities to be sold
| Security | Acquired | Nature of acquisition | Acquired from | Amount acquired | Gift transaction | Payment date | Nature of payment |
|---|---|---|---|---|---|---|---|
| Common | 05/21/2026 | Restricted Stock | Issuer | 2,000 | N | 05/21/2026 | Not Applicable |
Prior-sale reporting
- Nothing to report for the preceding three months
- Y
Notice signature
- Notice date
- 09/29/2026
- Signed
- /s/ David Brian Miller
- Plan adoption dates
- 06/11/2026
Company context
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.